On September 18th local time, chip manufacturer Intel announced a significant breakthrough in the development of glass substrates for next-generation advanced packaging.Prior to the Intel 2023 Innovation Conference held in San Jose, California, this week, Intel announced this "milestone like achievement" and stated that it will redefine the boundaries of chip packaging, providing game-changing solutions for data centers, artificial intelligence, and graphics construction, and promoting Moore's Law progress...

Author |FfSource |Jiguo Editorial DepartmentIn the past two years, the development speed of Xiaomi's digital flagship has been quite fast, not only breaking the curse of not paying for a pair, but also impacting the high-end flagship mobile phone market.During the 618 period of this year, with prices above 4000 yuan, besides the Apple iPhone 14 series, the domestically produced Xiaomi 13 had the best sales, even surpassing the Huawei P60,It can only be said that the "bucket" configuration with a small screen is indeed deeply rooted in people's hearts, and it seems that Xiaomi has taken the right path...

On May 25th, the 2023 Zhongguancun Forum, with the annual theme of "Open Cooperation and Shared Future", opened in Beijing. At the exhibition, domestically developed interventional surgical robots were unveiled through the "Green Channel" of the National Drug Administration...