Samsung's 2nm Chip Technology Breakthrough: Backside Power Delivery Network (BSPDN) Enables a Smaller, Faster, and More Energy-Efficient Future

Samsung's 2nm Chip Technology Breakthrough: Backside Power Delivery Network (BSPDN) Enables a Smaller, Faster

Samsung's 2nm Chip Technology Breakthrough: Backside Power Delivery Network (BSPDN) Enables a Smaller, Faster, and More Energy-Efficient Future

According to the Korea Economic Daily, Sungjae Lee, Samsung Electronics Vice President and Head of the Wafer Foundry PDK Development Team, presented the company's latest breakthrough in semiconductor technology on August 22nd the Backside Power Delivery Network (BSPDN) technology. This innovative technology will reduce the size of 2nm chips by 17% while achieving significant optimization with an 8% performance increase and a 15% power consumption reduction.

Sungjae Lee stated that BSPDN technology is a major technological innovation that effectively reduces chip size and enhances performance and energy efficiency by building a power delivery network on the back of the chip. Traditional chip power delivery networks are typically located on the front side of the chip, which limits further chip size reduction. BSPDN technology, however, shifts the power delivery network to the back of the chip, freeing up space on the front side and offering greater flexibility for chip design.

In addition to size reduction, BSPDN technology can effectively minimize power loss within the chip. As the power delivery network is closer to the chip core, the current transmission path is shorter, thereby reducing resistance and energy loss, resulting in improved overall chip efficiency.

Samsung plans to implement BSPDN technology in mass production of its 2nm process starting in 2027. This means that in the coming years, we can expect to see smaller, faster, and more energy-efficient chip products, opening up new possibilities for improving performance and reducing power consumption in electronic devices.

The application of BSPDN technology will bring significant performance improvement and energy efficiency optimization to various electronic devices, including smartphones, laptops, and servers. Smaller, faster chips will make devices lighter and faster, while lower power consumption will extend battery life and enhance user experience.

Samsung's continuous innovation in the field of semiconductor technology will drive progress across the industry and provide strong technological support for the development of future electronic devices. The application of BSPDN technology will mark a new era in chip technology, ushering in a smaller, faster, and more energy-efficient future.

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