Contribute youthful strength to China's "core"! High vocational students born in the 2000s independently develop domestically produced chip cooling materials

The surface modified diamond particles are loaded into the metal mold, and then the mold and copper are placed in a vacuum pressure infiltration furnace. The furnace is vacuumed and heated to about 1000 degrees Celsius, and the melted copper liquid is poured into the composite billet

The surface modified diamond particles are loaded into the metal mold, and then the mold and copper are placed in a vacuum pressure infiltration furnace. The furnace is vacuumed and heated to about 1000 degrees Celsius, and the melted copper liquid is poured into the composite billet... After about five hours of powder loading and discharging, a furnace of diamond/copper composite products with excellent heat dissipation performance is successfully prepared.

This is a high conductivity diamond/copper heat dissipation product independently developed by the innovative and entrepreneurial team of students from Hunan Vocational and Technical College of Industry in the "High Conductivity" Core Materials - Opening a New Era of Chip Heat Dissipation ". The emergence of this technology product provides strong basic material support for breaking the foreign technology blockade, promoting the progress of high-power chip packaging technology in China, and upgrading the third-generation semiconductor chip application system in China. The team won the first prize of the vocational education track creative group in the 9th "Internet plus" College Students Innovation and Entrepreneurship Competition in Hunan Province.

the post-00s generationyouthSelf built team,To overcome difficultiesChinese chip cooling materialsPain point issues

,,,,,,,,2021,Chinese chip cooling materials,,,

,,,,1five

202110,7five09,,,,8,3,40,44

,the post-00s generationyouth,,,,,

800 experimentsthousandDegree high temperature,Craft spirit, forge ahead

,,,3,,five0-10012,,

/,,,,,,five0,thousand,/

/,1,,,,,,,/,104m,100,,thousand,40,,

,800,,3,/,,,

,/700W/mK890W/mK,1.60.8,

fiveH per furnaceMass production,Domestic heat dissipation materials assist in chip upgrade iteration

/9.five,fiveh/,five8%,16five,30%,/300190,/,0.01,/

, 70,1,five%, five02five1/6/,,,,

,fiveG,,,

,,,,,

Disclaimer: The content of this article is sourced from the internet. The copyright of the text, images, and other materials belongs to the original author. The platform reprints the materials for the purpose of conveying more information. The content of the article is for reference and learning only, and should not be used for commercial purposes. If it infringes on your legitimate rights and interests, please contact us promptly and we will handle it as soon as possible! We respect copyright and are committed to protecting it. Thank you for sharing.(Email:[email protected])