Foreign media once again dismantled Huawei, with only foreign original components in the memory | Xinchao IC Morning PostForeign media: So far, only Huawei Mate60Pro memory has been found to be imported, while other components are made in ChinaAccording to Bloomberg, Huawei's Mate60Pro smartphone uses an unusually high proportion of Chinese components in addition to its main processor. According to the latest round of analysis conducted by TechInsights for Bloomberg, the RF front-end module of the Mate60Pro comes from Angruiwei, the satellite communication modem comes from Huali Chuangtong, and the RF transceiver comes from Guangzhou Tianrunxin Technology

Foreign media once again dismantled Huawei, with only foreign original components in the memory | Xinchao IC Morning Post

Foreign media: So far, only Huawei Mate60Pro memory has been found to be imported, while other components are made in China

According to Bloomberg, Huawei's Mate60Pro smartphone uses an unusually high proportion of Chinese components in addition to its main processor. According to the latest round of analysis conducted by TechInsights for Bloomberg, the RF front-end module of the Mate60Pro comes from Angruiwei, the satellite communication modem comes from Huali Chuangtong, and the RF transceiver comes from Guangzhou Tianrunxin Technology. So far, the dismantling workOnly foreign origin components found in memory. (Jiwei Network)

SIA: In July 2023, the global semiconductor industry's total sales reached $43.2 billion, an increase of 2.3% month on month

The Semiconductor Industry Association (SIA) of the United States recently announced that global semiconductor industry sales in July 2023 totaled $43.2 billion, an increase of 2.3% compared to the previous month's total of $42.2 billion, but a decrease of 11.8% compared to the same period in July 2022. Compared to last year, global sales are still declining, but July's sales were the fourth consecutive month of growth, and the year-on-year decline is also the best performance so far this year. (TechSugar)

The first phase of the National Third Generation Semiconductor Technology Innovation Center (Nanjing) project has been completed and put into operation

On September 6th, the National Third Generation Semiconductor Technology Innovation Center (Nanjing) announced the completion and operation of the first phase of the project. It is reported that the first phase of the project relies on 55 existing 11 # factory areas to create a 6-inch SiC power electronic device research and development and pilot platform. With the first phase of the project put into operation, the second phase is planned to commence construction in 2024. It will build an 8-inch third-generation semiconductor chip manufacturing, advanced wafer packaging, and module packaging platform, with an annual production capacity of 200000 8-inch wafers.

1. Calculate the launch guidance for the lithography unicorn Dongfang Jingyuan, and the product has been delivered to manufacturers such as SMIC International;

2. TSMC's US plant will undergo small-scale trial production in Q1 2024;

3. Guo Mingyi stated that Apple will launch its self-developed 5G baseband iPhone model in 2025;

4. Li Ji Dian: Next year, it will launch a affordable version of AI chips, produced using a 28nm process;

5. It is reported that Samsung is developing a new generation of "cache DRAM" technology: it improves energy efficiency by 60% compared to HBM and reduces data mobility latency by 50%.

Source: Xinchao IC

Editor: Huang Keshu

First instance: Jiang Hao

Second instance: Chen Hua

Third Reviewer: Yang Hong

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