Intel announces its PowerVia technology for chip back power supply

On June 6th, according to Intel, it has implemented backside power delivery technology on product level test chips to meet the performance requirements for the next computing era.It is reported that as Intel's back power supply solution, PowerVia will be launched on the Intel20A process node in the first half of 2024

On June 6th, according to Intel, it has implemented backside power delivery technology on product level test chips to meet the performance requirements for the next computing era.

It is reported that as Intel's back power supply solution, PowerVia will be launched on the Intel20A process node in the first half of 2024. By moving the power cord to the back of the wafer, PowerVia solves the increasingly serious interconnect bottleneck problem in chip unit area miniaturization.

Ben Sell, Vice President of Intel Technology Development, stated that, Intel is actively promoting the 'Four Year Five Process Nodes' plan and is committed to integrating one trillion transistors in a single package by 2030. PowerVia is an important milestone for both goals. By adopting pilot produced process nodes and their test chips, Intel has reduced the risk of using back power for advanced process nodes and brought back power technology to the market

It is reported that Intel will separate the research and development of PowerVia technology and transistors to ensure that PowerVia can be properly used in the production of Intel20A and Intel18A process chips. Before integrating with the RibbonFET transistor, which will also be launched with the Intel20A process node, PowerVia conducted testing on its internal testing node to continuously debug and ensure its functionality is good. Intel stated that by adopting and testing PowerVia on test chips, it has been confirmed that this technology can significantly improve chip usage efficiency, with a cell utilization rate of over 90%, and help achieve significant transistor miniaturization, allowing chip design companies to improve product performance and energy efficiency.

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